Semiconductor device, method and apparatus for testing same,...

Details Semiconductor device, method and apparatus for testing same,... Semiconductor device, method and apparatus for testing same,...

2008-07-01

2008-07-01

Hollington, Jermele M (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

Reexamination Certificate

active

07394270

ABSTRACT:
The semiconductor device according to an aspect of the present invention is a semiconductor device having an electrode pad to be contacted a test probe for performing probe testing, a bonding area mark for defining a bonding area which performs wire boding on the electrode pad, and a probe area mark for defining a probe repair area for repairing or replacing the test probe for the electrode pad.

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patent: 2004/0069988 (2004-04-01), Lin
patent: 2005/0085009 (2005-04-01), Yamaguchi et al.
patent: 2006/0279001 (2006-12-01), Nishida
patent: 7-147304 (1995-06-01), None
patent: 2002-329742 (2002-11-01), None
Chinese Office Action dated Aug. 10, 2007, with an English translation.

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