Semiconductor device, method and apparatus for fabricating...

Details Semiconductor device, method and apparatus for fabricating... Semiconductor device, method and apparatus for fabricating...

2005-11-14

2008-07-29

Parekh, Nitin (Department: 2811)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S123000, C438S127000, C257S796000, C257SE23051

Reexamination Certificate

active

07405107

ABSTRACT:
A semiconductor device has at least one semiconductor element, at least one radiator plate thermally connected with said semiconductor element, and a molded resin covering and sealing said semiconductor device and said radiator, wherein an outer main surface of the radiator plate and at least a part of the side surface adjoining the outer main surface are exposed from the molded resin.

REFERENCES:
patent: 6048483 (2000-04-01), Miyajima
patent: 6224360 (2001-05-01), Miyajima
patent: 6893898 (2005-05-01), Ito et al.
patent: 2002/0171173 (2002-11-01), Tsuchida
patent: 2004/0104458 (2004-06-01), Tsukada et al.
patent: 10-34699 (1998-02-01), None
patent: 10-223669 (1998-08-01), None
patent: 11-307559 (1999-11-01), None
patent: 2003-154551 (2003-05-01), None

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