Semiconductor device manufacturing method wherein the substrate

Optics: measuring and testing – By polarized light examination – With birefringent element

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356358, 356400, G01B 902

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active

055637086

ABSTRACT:
In a step-and-repeat type semiconductor device manufacturing exposure apparatus, a pattern of a reticle can be transferred to a wafer with no chip rotation or no array error. For this sake, the direction of rotation of an X axis or a Y axis of the reticle about a Z axis is detected, and an X-Y-.theta. stage is rotationally moved about the Z axis in accordance with the detected value and by using a measurement output of a laser interferometer. Also, after rotational movement of the X-Y-.theta. stage about the Z axis, the X-Y-.theta. stage is moved while using a measurement output of the laser interferometer, to print the pattern of the reticle onto different zones of the wafer sequentially.

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