Semiconductor device manufacturing method using ultrasonic...

Details Semiconductor device manufacturing method using ultrasonic... Semiconductor device manufacturing method using ultrasonic...

2005-01-04

2005-01-04

Niebling, John F. (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S108000, C438S120000, C438S613000

Reexamination Certificate

active

06838316

ABSTRACT:
A bump is formed on at least one of a semiconductor chip and printed circuit board. A sealing material is applied to the surface of one of the semiconductor chip and printed circuit board. The printed circuit board is flip-chip-connected to the semiconductor chip via the sealing material while ultrasonic waves are applied to the printed circuit board to promote bonding by the bump.

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Communication from Japanese Patent Office dated Jun. 22, 2004, and the English translation thereof.

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