Semiconductor device manufacturing method using mask...

Details Semiconductor device manufacturing method using mask... Semiconductor device manufacturing method using mask...

2005-05-24

2005-05-24

Thompson, Craig A. (Department: 2813)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

C438S800000

Reexamination Certificate

active

06897126

ABSTRACT:
In a method of manufacturing a compound semiconductor device, individual chip patterns are projected onto a (1 0 0) surface of a GaAs wafer so that the columns and rows of the chip patterns are aligned in a direction slanting by 45 degrees with respect to a [0 1 1] direction of the GaAs wafer. The wafer is diced along this slanting direction and chipping along the edges of the individual separated chips is greatly reduced.

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Taiwan Office Action dated Jun. 12, 2003.

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