Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2005-11-22
2005-11-22
Potter, Roy (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S773000
Reexamination Certificate
active
06967399
ABSTRACT:
A semiconductor device including a semiconductor element having an electrode pad, a mounting terminal for mounting a substrate, an adhesive layer provided on the semiconductor element, and a wiring electrically connecting the electrode pad to the mounting terminal. The wiring includes a metal foil and a metal film layer. The entire metal foil is in contact with the adhesive layer, and the metal film layer is in contact with the electrode pad.
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Copy of European Patent Office Communication with European Search Report for corresponding European Patent Application No. 01304902 dates Jan. 9, 2004.
Aiba Yoshitaka
Sato Mitsutaka
Armstrong Kratz Quintos Hanson & Brooks, LLP
Potter Roy
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