Semiconductor device, manufacturing method, and system

Details Semiconductor device, manufacturing method, and system Semiconductor device, manufacturing method, and system

1989-12-01

1991-01-29

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

148DIG1, 148DIG6, 148DIG21, 437 81, 437131, 437173, 437200, 437914, 437926, H01L 2120

Patent

active

049886428

ABSTRACT:
An improved semiconductor device manufacturing system and method is shown. In the system, undesirable sputtering effect can be averted by virtue of a combination of an ECR system and a CVD system. Prior to the deposition according to the above combination, a sub-layer can be pre-formed of a substrate in a reaction chamber and transported to another chamber in which deposition is made according to the combination without making contact with air, so that a junction thus formed has good characteristics.

REFERENCES:
patent: 4481229 (1984-11-01), Suzuki et al.
patent: 4505950 (1985-03-01), Yamazaki
patent: 4532199 (1985-07-01), Ueno et al.
patent: 4539934 (1985-09-01), Fujiyama et al.
patent: 4543267 (1985-09-01), Yamazaki
patent: 4582720 (1986-04-01), Yamazaki
patent: 4592306 (1986-06-01), Gallego
patent: 4636401 (1987-01-01), Yamazaki et al.
patent: 4666734 (1987-05-01), Kamiya et al.

Affiliated with

Also associated with

Rating

Semiconductor device, manufacturing method, and system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device, manufacturing method, and system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device, manufacturing method, and system will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-813328