Semiconductor device manufacturing method and semiconductor...

Details Semiconductor device manufacturing method and semiconductor... Semiconductor device manufacturing method and semiconductor...

2007-03-06

2007-03-06

Young, Christopher G. (Department: 1756)

Radiation imagery chemistry: process, composition, or product th

Including control feature responsive to a test or measurement

C430S312000, C430S313000, C430S316000, C716S030000

Reexamination Certificate

active

11070097

ABSTRACT:
In a semiconductor device manufacturing method, the step of calculating an exposure time of a photoresist includes (a) a step of deciding whether or not a variation of a line width of a device pattern104or a resist pattern102ain a reference chip in a plurality of semiconductor wafers101that are manufactured in the past and have the same wafer information as an subject semiconductor wafer101is contained within a tolerance over a plurality of semiconductor wafers101in the past, and (b) a step of correcting the exposure time every chip by using an exposure correction table22if it is decided in the step (a) that the variation falls within the tolerance.

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