Semiconductor device manufacturing method and manufacturing...

Details Semiconductor device manufacturing method and manufacturing... Semiconductor device manufacturing method and manufacturing...

2004-11-11

2008-01-08

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S110000, C438S464000, C438S461000, C257S668000, C257S692000, C257SE23055

Reexamination Certificate

active

07316939

ABSTRACT:
A method for manufacturing a semiconductor device is provided including: providing a reinforcing member on one surface of a wiring substrate that has a first region where a semiconductor chip is mounted and a second region around the first region, and has terminals extending from the first region to the second region formed on another surface thereof in a manner that the reinforcing member overlaps the terminals and a part thereof protrudes from the first region to the second region; cutting the terminals along a boundary between the first region and the second region; and continuously cutting the reinforcing member from an inboard side thereof to an outboard side along the boundary between the first region and the second region.

REFERENCES:
patent: 5427641 (1995-06-01), Muramatsu et al.
patent: 5763940 (1998-06-01), Shibusawa et al.
patent: 6084291 (2000-07-01), Fujimori
patent: 6274405 (2001-08-01), Hashimoto
patent: 6313526 (2001-11-01), Nakamura
patent: 6559524 (2003-05-01), Seko
patent: 6624520 (2003-09-01), Nakamura
patent: 6633002 (2003-10-01), Atou
patent: 6744120 (2004-06-01), Yanagisawa
patent: 6911729 (2005-06-01), Chikawa
patent: 7169643 (2007-01-01), Hashimoto
patent: 09-312312 (1997-02-01), None
patent: 2002-261131 (2002-09-01), None
patent: 2003-198070 (2003-07-01), None
patent: 2005150373 (2005-06-01), None
patent: 2005150374 (2005-06-01), None
patent: WO 0048243 (2000-08-01), None
Communication from Japanese Patent Office re: related application.

Affiliated with

Also associated with

Rating

Semiconductor device manufacturing method and manufacturing... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device manufacturing method and manufacturing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device manufacturing method and manufacturing... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3962627