Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2008-01-29
2008-01-29
Wilczewski, Mary (Department: 2822)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S106000, C438S118000
Reexamination Certificate
active
07323365
ABSTRACT:
A method for manufacturing a semiconductor device is provided including: providing a reinforcing member on one surface of a wiring substrate that has a first region where a semiconductor chip is mounted and a second region around the first region, and has terminals extending from the first region to the second region formed on another surface thereof, in a manner that the reinforcing member overlaps the terminals and a part thereof protrudes from the first region to the second region; punching through from a surface side having the terminals in the wiring substrate, thereby cutting the terminals along a boundary between the first region and the second region; and punching through from the surface side having the reinforcing member in the wiring substrate, thereby continuously cutting the reinforcing member from an inboard side thereof to an outboard side along the boundary between the first region and the second region.
REFERENCES:
patent: 09-312312 (1997-12-01), None
patent: 2002-261131 (2002-09-01), None
patent: WO 0048243 (2000-08-01), None
Communication from Japanese Patent Office regarding related application.
Harness & Dickey & Pierce P.L.C.
Perkins Pamela E
Seiko Epson Corporation
Wilczewski Mary
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