Semiconductor device manufacturing: process – Having magnetic or ferroelectric component
Reexamination Certificate
2006-09-06
2008-10-07
Dang, Trung (Department: 2892)
Semiconductor device manufacturing: process
Having magnetic or ferroelectric component
C438S108000, C438S455000
Reexamination Certificate
active
07432114
ABSTRACT:
To provide a low-cost, efficient semiconductor device manufacturing method for connecting electrodes of a pair of bases (e.g., a pair of a semiconductor chip and a circuit board, or a pair of semiconductor chips) together in a short time. The method of the present invention includes: forming magnetic bumps34on at least one of first and second bases10A and40to be bonded together at their corresponding electrodes (e.g., electrodes15and electrodes41); aligning the electrodes15of the first base10A to positions corresponding to the electrodes41of the second base40for connection, by means of magnetic forces of the magnetic bumps34formed over the first base10A; and connecting the electrodes15of the first base10A to the electrodes41of the second base40, wherein the alignment is made for a plurality of the first bases10A at a time.
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Mizukoshi Masataka
Shimobeppu Yuzo
Shinjo Yoshiaki
Teshirogi Kazuo
Yoshimoto Kazuhiro
Dang Trung
Fujitsu Limited
Westerman, Hattori, Daniels & Adrian , LLP.
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