Fishing – trapping – and vermin destroying
Patent
1994-01-11
1996-01-02
Hearn, Brian E.
Fishing, trapping, and vermin destroying
437182, 437183, 437189, 437206, H01L 2160
Patent
active
054808391
ABSTRACT:
With a semiconductor device manufacturing method, a lower-layer interconnection is formed on a circuit board on which a plurality of semiconductor chips are mounted. Using a screen plate with openings corresponding to desired positions on the lower-layer interconnection, screen printing of a metal paste is effected, and the printed metal paste is dried and calcined by heat treatment to form a metal pillar on the lower-layer interconnection. An insulating film covering the lower-layer interconnection and the metal pillar is formed so that the tip of the metal pillar may be exposed. An upper-layer interconnection is formed on the insulating film so that this layer may contact with the exposed tip of the metal pillar.
REFERENCES:
patent: 4712161 (1987-12-01), Pryor et al.
patent: 4914056 (1990-04-01), Okumura
patent: 4917759 (1990-04-01), Fisher et al.
patent: 5056215 (1991-10-01), Blanton
patent: 5128746 (1992-07-01), Pennisi et al.
patent: 5136363 (1992-08-01), Endo et al.
patent: 5139969 (1992-08-01), Mori
patent: 5277786 (1994-01-01), Kawakami
patent: 5282565 (1994-02-01), Melton
patent: 5290732 (1994-03-01), Kumar et al.
patent: 5296736 (1994-03-01), Frei et al.
patent: 5318651 (1994-06-01), Matsui et al.
U.S. Patent Application Serial No. 08/075,373 filed Jun. 14, 1993.
Ezawa Hirokazu
Miyata Masahiro
Hearn Brian E.
Kabushiki Kaisha Toshiba
Picardat Kevin M.
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