Abrading – Abrading process – With critical nonabrading work treating
Reexamination Certificate
2006-11-28
2006-11-28
Ackun, Jr., Jacob K. (Department: 3723)
Abrading
Abrading process
With critical nonabrading work treating
C438S460000
Reexamination Certificate
active
07140951
ABSTRACT:
An apparatus for manufacturing a semiconductor device includes a first affixing mechanism, cutting mechanism, a second affixing mechanism and peeling mechanism. The first affixing mechanism affixes a first holding member to a rear surface of a semiconductor wafer which is opposite to an element forming surface thereof. The cutting mechanism cuts and discretely divides the semiconductor wafer. The second affixing mechanism affixes a second holding member to the element forming surface side of the semiconductor wafer while the first holding member is expanded to widen gaps of semiconductor elements of the discretely divided semiconductor wafer. The peeling mechanism peels the first holding member.
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Notification of Reasons for Rejection (Office Action) for Japanese Patent Application No. 2003-004618, mailed Nov. 22. 2005 and English translation thereof.
Ackun Jr. Jacob K.
Finnegan Henderson Farabow Garrett & Dunner L.L.P.
Kabushiki Kaisha Toshiba
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