Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1993-11-03
1995-07-18
Breneman, R. Bruce
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
118723E, 118723MW, 118723MR, 118723AN, 118723R, 118666, 216 61, H01L 2100, C23C 1600
Patent
active
054338131
ABSTRACT:
In a semiconductor device manufacturing apparatus of a reactive ion etching apparatus or the like, only a DC signal in a high frequency electric field can be accurately detected in a real-time manner without any noise, thereby enabling a temperature, a potential, or another parameter of a substrate (wafer) to be accurately measured. For this purpose, according to this manufacturing apparatus, a transmission line filter (coaxial cable) 8 having an electric length ((2n+1).lambda./4) that is an odd-number times as long as 1/4 of the wavelength .lambda. of a high frequency power source 1 is connected between a thermocouple or electrode 7 and a voltmeter 10 to measure a temperature or another parameter of a wafer (substrate) 5. A high frequency signal is separated by the transmission line filter, and a high frequency impedance is short-circuited by a capacitance 9 resulting in the high frequency component being removed, and only a DC signal being provided to the voltmeter 10.
REFERENCES:
patent: 5231690 (1993-07-01), Soma et al.
patent: 5232509 (1993-08-01), Min et al.
"The Study of Semiconductor," Edited by Nishizawa, Kogyo Chosakai, vol. 17, p. 227 et seq.
Baskin Jonathan D.
Breneman R. Bruce
Canon Kabushiki Kaisha
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