Electric heating – Heating devices – Combined with container – enclosure – or support for material...
Patent
1991-09-30
1993-09-14
Reynolds, Bruce A.
Electric heating
Heating devices
Combined with container, enclosure, or support for material...
392416, 392418, 118724, 432239, 414150, F27D 1502, H01L 2122
Patent
active
052451585
ABSTRACT:
A semiconductor device manufacturing apparatus has a heat retaining tube which can be freely placed in and pulled out of a processing chamber of the apparatus. When located within the processing chamber, the heat retaining tube surrounds a boat with the semiconductor wafers mounted thereon. After the thermal processing of the semiconductor wafers has been completed, the heat retaining tube and the semiconductor wafers are pulled out of the processing chamber together. In this way, the difference in the temperature of the center and periphery of the semiconductor wafer is decreased, and semiconductor devices, which have excellent performance and which are free from crystalline defects or dislocation, can thus be manufactured.
REFERENCES:
patent: 3385921 (1968-05-01), Hampton
patent: 4526534 (1985-07-01), Wollmann
patent: 4543059 (1985-09-01), Whang
patent: 4573431 (1986-03-01), Sarkozy
patent: 4610628 (1986-09-01), Mizushima
patent: 4766678 (1988-08-01), Yanase
patent: 4938691 (1990-07-01), Ohkase et al.
patent: 4954684 (1990-09-01), Aoki et al.
patent: 4957781 (1990-09-01), Kanegae
patent: 5000682 (1991-07-01), Heidt et al.
patent: 5080039 (1992-01-01), Kanegae
Hashizume Yasushi
Tomikawa Mitsuhiro
Jeffery John A.
Mitsubishi Denki & Kabushiki Kaisha
Reynolds Bruce A.
LandOfFree
Semiconductor device manufacturing apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device manufacturing apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device manufacturing apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2029121