Semiconductor device manufacturing apparatus

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering

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Details

20429806, 20429819, 20429834, 20429837, 156345, C23C 1434

Patent

active

055542662

ABSTRACT:
In a semiconductor device manufacturing apparatus having a holder for holding a semiconductor wafer to be processed within a reaction vessel, the holder is provided with a separator for preventing ends of the semiconductor wafer from being brought into contact with the holder. Further, in a semiconductor device manufacturing apparatus having a holder functioning as a cathode, for holding a semiconductor wafer to be processed; an anode provided on the semiconductor wafer side so as to be opposed to the holder; a plurality of magnets arranged in the vicinity of the anode, for generating magnetic force lines on a surface of the anode; and a section for applying a high voltage between the anode and the cathode to generate an electric field so that plasma can be generated at intersectional portions between the generated magnetic force lines and the generated electric field, the apparatus further includes a separator provided for the holder, for preventing ends of the semiconductor wafer to be processed from being brought into contact with the holder. The separator provided for the holder is a stepped portion or a recessed portion formed on the holder.

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patent: 4999096 (1991-03-01), Niher et al.
patent: 5057185 (1991-10-01), Thomas, III et al.

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