Coating apparatus – With vacuum or fluid pressure chamber
Patent
1985-03-01
1987-04-07
McIntosh, John P.
Coating apparatus
With vacuum or fluid pressure chamber
118 53, 118 54, 118416, 118612, B05C 318, B05C 1302
Patent
active
046551620
ABSTRACT:
The present invention provides a semiconductor device manufacturing apparatus which, in processing wafers with processing liquid, prevents dust contamination of a wafer surface to be processed, enables fine control of processing liquid temperature, enables the wafer surface to be processed uniformly, permits use of only a small amount of processing liquid, and can be adapted for mixed solvents. The apparatus according to the present invention comprises a cup containing the processing liquid, vacuum chuck means holding the wafer by suction on the upper surface of the wafer, and means by which the wafer surface is brought into dynamic contact with the processing liquid.
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patent: 1911124 (1933-05-01), Linder et al.
patent: 2169805 (1939-08-01), Kronquest
patent: 3755011 (1973-08-01), Kleinknecht et al.
patent: 3903841 (1975-09-01), Peters
patent: 4006707 (1977-02-01), Denslow
McIntosh John P.
Nippon Kogaku K. K.
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