Semiconductor device manufacture

Details Semiconductor device manufacture Semiconductor device manufacture

1975-03-03

1977-05-17

Smith, Al Lawrence

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228124, 228208, B23K 102, H01L 2158

Patent

active

040237257

ABSTRACT:
A method of bonding a semiconductor body to a supporting member where the whole back face of the semiconductor body is covered with a thin evaporated layer of chromium or titanium, which layer is then covered with a thin evaporated layer of rhodium, platinum or palladium, which is in turn bonded by a film of solder to the supporting member.

REFERENCES:
patent: 3339267 (1967-09-01), Bronnes et al.

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