Metal treatment – Compositions – Heat treating
Patent
1975-12-31
1977-02-01
Ozaki, G.
Metal treatment
Compositions
Heat treating
148171, 148172, 148177, 148179, 148186, 148187, 148188, 357 48, H01L 21225
Patent
active
040060403
ABSTRACT:
An improved method of initiating the moving of a molten zone of a metal-rich semiconductor material through a solid body of the same semiconductor material embodies the sintering of the metal to the surface of the body. The sintering process enables one to migrate two or more intersecting "wires" simultaneously as well as three wires intersecting at a common point of origin.
REFERENCES:
patent: 2813048 (1957-11-01), Pfann
patent: 3897277 (1975-07-01), Blumenfeld
patent: 3898106 (1975-08-01), Cline et al.
patent: 3899361 (1975-08-01), Cline et al.
patent: 3899362 (1975-08-01), Cline et al.
patent: 3901736 (1975-08-01), Anthony et al.
patent: 3902925 (1975-09-01), Anthony et al.
patent: 3904442 (1975-09-01), Anthony et al.
patent: 3910801 (1975-10-01), Cline et al.
patent: 3936319 (1976-02-01), Anthony et al.
patent: 3956023 (1976-05-01), Cline et al.
Anthony Thomas R.
Chang Mike F.
Cline Harvey E.
Cohen Joseph T.
General Electric Company
Ozaki G.
Squillaro Jerome C.
Winegar Donald M.
LandOfFree
Semiconductor device manufacture does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device manufacture, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device manufacture will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1090079