Semiconductor device manufacture

Details Semiconductor device manufacture Semiconductor device manufacture

1974-10-29

1976-11-23

Rutledge, L. Dewayne

Metal treatment

Compositions

Heat treating

250492A, 335289, 357 91, H01L 21263

Patent

active

039935094

ABSTRACT:
A semiconductor wafer is electrostatically clamped against a support by positioning an intermediate solid dielectric layer therebetween and applying a potential difference, thereby firmly and evenly clamping the wafer for photoresist or ion beam implantation operations.

REFERENCES:
patent: 3383567 (1968-05-01), King et al.
patent: 3413531 (1968-11-01), Leith
patent: 3547074 (1970-12-01), Hirschfeld
patent: 3717785 (1973-02-01), Guernet
patent: 3750083 (1973-07-01), Fayling

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