Active solid-state devices (e.g. – transistors – solid-state diode – Specified wide band gap semiconductor material other than... – Diamond or silicon carbide
Reexamination Certificate
2005-08-30
2005-08-30
Weiss, Howard (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Specified wide band gap semiconductor material other than...
Diamond or silicon carbide
C257S109000, C257S421000
Reexamination Certificate
active
06936850
ABSTRACT:
The semiconductor device includes a first semiconductor region made from n-conducting SiC and a second semiconductor region made from p-conducting SiC. A Schottky contact layer electrically contacts the first semiconductor region, and an ohmic p-contact layer electrically contacts the second semiconductor region. Both contact layers consist of a nickel-aluminum material. This allows both contact layers to be annealed together without adversely effecting the Schottky contact behavior.
REFERENCES:
patent: 4310568 (1982-01-01), Howard et al.
patent: 4641174 (1987-02-01), Baliga
patent: 4982260 (1991-01-01), Chang et al.
patent: 5270252 (1993-12-01), Papanicolaou
patent: 5471072 (1995-11-01), Papanicolaou
patent: 5895260 (1999-04-01), Bhatnagar et al.
patent: 5929523 (1999-07-01), Parsons
patent: 6313482 (2001-11-01), Baliga
patent: 6373076 (2002-04-01), Alok et al.
patent: 1 962 814 (1971-06-01), None
patent: 44 01 858 (1995-07-01), None
patent: 197 23 176 (1998-08-01), None
patent: 0 380 340 (1990-08-01), None
patent: 0 380 340 (1990-08-01), None
patent: 06-061475 (1994-03-01), None
patent: 96/03774 (1996-02-01), None
Translation of 06-061475 from the Patent Abstracts of Japan, Pub. Date Apr. 3, 1994.
“Status of Silicon Carbide (SiC) as a Wide-Bandgap Semiconductor for High-Temperature Applications: A Review” (Casady et al.), Solid-State Electronics, vol. 39, No. 11, pp. 1409-1422.
“A critical Review of Ohmic and Rectifying Contacts for Silicon Carbide” (Porter et al.), Materials Science and Engineering B.34, 1995, pp. 83-105.
“High Voltage Ni/4H-SiC Schottky Rectifiers” (Chilukuri et al.), ISPSD 99, Proceedings, May 1999, pp. 161-164.
“A Dual-Metal-Trench Schottky Pinch-Rectifier in 4H-SiC” (Schoen et al.), IEEE Electron Device Letters, vol. 19, No. 4, Apr. 1998, pp. 97-99.
“The Guard-Ring Termination for the High-Voltage SiC Schottky Barrier Diodes” (Ueno et al.), IEEE Electron Device Letters, vol. 16, No. 7, Jul. 1995.
Ohmic Contacts to p-Type SiC with Improved Thermal Stability (Liu et al.), Materials Science Forum, vols. 264-68, pp. 791-794.
Friedrichs Peter
Peters Dethard
Schoerner Reinhold
SiCED Electronics Development GmbH & Co. KG
Weiss Howard
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