Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1996-11-29
1999-01-12
Ledynh, Bot L.
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
257676, 257693, H01L 2328
Patent
active
058593870
ABSTRACT:
A semiconductor device includes a lead frame assembly having a die attach pad with a die secured by a die bonding material. A portion of the die bonding material may flow out from between the die and the die attach pad to form a squash out layer. A raised bond pad is at least partially in the squash out layer area and extends upward from said die attach pad sufficient to be above the squash out layer. A bond wire has one end secured to a ground terminal on the die and the other end to the raised bond pad. The whole structure is encapsulated in a plastic package.
REFERENCES:
patent: 3930114 (1975-12-01), Hodge
patent: 4751611 (1988-06-01), Arai et al.
patent: 4916506 (1990-04-01), Gagnon
patent: 4994895 (1991-02-01), Matsuzaki et al.
patent: 5289344 (1994-02-01), Gagnon et al.
patent: 5291059 (1994-03-01), Ishituka et al.
patent: 5332864 (1994-07-01), Liang et al.
patent: 5389818 (1995-02-01), Inoue et al.
patent: 5420459 (1995-05-01), Kozono
patent: 5437915 (1995-08-01), Nishimura et al.
patent: 5479050 (1995-12-01), Pritchard et al.
patent: 5530281 (1996-06-01), Groover
patent: 5661338 (1997-08-01), Yoo et al.
Allegro Microsystems Inc.
Hooks Arthur K.
Ledynh Bot L.
Ngo Hung V.
Rasmussen David G.
LandOfFree
Semiconductor device leadframe die attach pad having a raised bo does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device leadframe die attach pad having a raised bo, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device leadframe die attach pad having a raised bo will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1518810