Semiconductor device lead frame with rounded edges

Details Semiconductor device lead frame with rounded edges Semiconductor device lead frame with rounded edges

1990-06-08

1992-01-21

James, Andrew J.

Fishing, trapping, and vermin destroying

357 68, 357 72, 357 65, 437220, H01L 2348, H01L 2328, H01L 2944, H01L 2160

Patent

active

050831860

ABSTRACT:
A leadframe including a die pad and inner leads the die pad having a substantially rounded edge configuration with no sharp edge, and the inner leads each having a trapezoidal cross-sectional configuration. In this construction, stresses are not concentrated in the end portion of the die pad due to temperature stresses and therefore, no cracks are formed in the resin encapsulating ICs. Accordingly, highly reliable ICS can be provided.

REFERENCES:
patent: 4298883 (1981-11-01), Komatsu et al.
patent: 4707418 (1987-11-01), Takiar et al.
patent: 4942452 (1990-07-01), Kitano et al.

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