Semiconductor device lead frame with etched through holes

Details Semiconductor device lead frame with etched through holes Semiconductor device lead frame with etched through holes

1988-02-24

1989-08-29

Mintel, William A.

Stock material or miscellaneous articles

Composite

Of bituminous or tarry residue

357 72, 357 73, 357 55, 357 68, 357 79, 428596, 428626, 174 522, H01L 2348

Patent

active

048622460

ABSTRACT:
Those portions (i.e., the inner lead portions) of the leads of a semiconductor device, which are sealed by a package, are formed with a plurality of depression in at least the surfaces and backs thereof such that the depressions have a smaller diameter at their bottoms than at their surfaces. As a result, both the adhesion strength between a sealer as the package and the inner lead portions of the leads and the mechanical strength of the leads are improved even in a semiconductor device having numerous leads. Moreover, the inner lead portions can be formed in their sides with a number of notches, which can be combined with those depressions to better improve the adhesion strength between the sealant and the inner lead portions of the leads and the mechanical strength of the leads.

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