Semiconductor device, lead frame therefor and memory card to pro

Details Semiconductor device, lead frame therefor and memory card to pro Semiconductor device, lead frame therefor and memory card to pro

1995-01-06

1997-06-03

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257666, 257679, 257723, 257787, H01L 23495

Patent

active

056357567

ABSTRACT:
A semiconductor device of a structure in which lateral surfaces of a semiconductor element and an element supporting member are bonded to each other without resorting to use of a base member on which the semiconductor element is disposed. Since thicknesses of the base member and a bonding resin provides no contribution to overall thickness of the semiconductor device, reduction of thickness thereof by 30 to 40% is made possible. In dependent on configuration of the element supporting member, the semiconductor device can be applied to large size elements, lead-on-chip structure (LOC) and others.

REFERENCES:
patent: 3708730 (1973-01-01), Schierz et al.
patent: 4137546 (1979-01-01), Frusco
patent: 4635092 (1987-01-01), Yerman et al.
patent: 4680613 (1987-07-01), Daniels et al.
patent: 4766478 (1988-08-01), Dennis
patent: 4816427 (1989-03-01), Dennis
patent: 4843224 (1989-06-01), Hoppe
patent: 4916506 (1990-04-01), Gagnon
patent: 4984062 (1991-01-01), Vemura et al.
patent: 4985748 (1991-01-01), Belanger, Jr.
patent: 5068712 (1991-11-01), Murakami et al.

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