Semiconductor device, lead frame and method for manufacturing se

Details Semiconductor device, lead frame and method for manufacturing se Semiconductor device, lead frame and method for manufacturing se

1995-06-07

1996-02-20

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

257666, H01L 2302, H01L 23495

Patent

active

054931517

ABSTRACT:
Outer leads are buried in a package. At least the contact portions of the outer leads which are connected to a circuit board are exposed from the package and the exposed portions make the same flat surfaces as the package surface. When forming the package, the outer leads are used as the side wall of a mold forming mold, and therefore, they are formed thicker than inner leads inside the package. Thus, the package thickness can be made equal to the thickness of the outer leads.

REFERENCES:
patent: 5134458 (1992-07-01), Tsutsumi et al.
patent: 5299092 (1994-03-01), Yaguchi et al.

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