Semiconductor device, its lead frame, and heat spreader having t

Details Semiconductor device, its lead frame, and heat spreader having t Semiconductor device, its lead frame, and heat spreader having t

1994-04-07

1997-02-18

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257675, 257707, 257796, H01L 2310, H01L 2334

Patent

active

056043783

ABSTRACT:
In a lead frame for a semiconductor device which includes a multiplicity of leads, and a heat spreader having an edge to which the leads are bonded by an insulating material coated with an adhesive, and a central portion to which a semiconductor chip is bonded, the heat spreader has a ring-shaped portion defined between its central portion and the inner ends of the leads, and having a width of at least 0.5 mm. The ring-shaped portion has a plurality of through holes occupying not more than 60% by area of that portion, and each of those holes has a width of at least 0.5 mm.

REFERENCES:
patent: 4809053 (1989-02-01), Kuraishi
patent: 4884124 (1989-11-01), Mori et al.
patent: 4891687 (1990-01-01), Mallik et al.
patent: 5068708 (1991-11-01), Newman
patent: 5225710 (1993-07-01), Westerkamp
patent: 5252855 (1993-10-01), Ogawa et al.
patent: 5365107 (1994-11-01), Kuraishi et al.
patent: 5397917 (1995-03-01), Ommen et al.

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