Semiconductor device, interposer chip and manufacturing...

Details Semiconductor device, interposer chip and manufacturing... Semiconductor device, interposer chip and manufacturing...

2006-12-28

2009-11-24

Cao, Phat X (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S777000

Reexamination Certificate

active

07622799

ABSTRACT:
A semiconductor device in which memory chips are stacked on the surface of a wiring substrate has a microcomputer chip and an interposer chip arranged on the surface of the memory chip. The pads of the microcomputer chip and the pads of the interposer chip are arranged almost circularly and are connected by bonding wires.

REFERENCES:
patent: 6376904 (2002-04-01), Haba et al.
patent: 6538331 (2003-03-01), Masuda et al.
patent: 2004/0140552 (2004-07-01), Kuroda et al.
patent: 2001217383 (2001-08-01), None
patent: 2004228323 (2004-08-01), None

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