Semiconductor device interconnection

Details Semiconductor device interconnection Semiconductor device interconnection

1995-04-21

1997-05-27

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257752, 257759, 257760, 257774, H01L 23053

Patent

active

056335326

ABSTRACT:
A semiconductor apparatus includes a semiconductor element and a substrate having a substrate base and a thin-film multilayer interconnection layer formed on the substrate base. The thin-film multilayer interconnection layer has insulating layers and interconnection patterns. The insulating layers and the interconnection patterns are alternately layered. Each of the insulating layers includes a first insulating layer part and a second insulating layer part. A surface of the second insulating layer part is more flat than that of the first insulating layer part, and each of the interconnection patterns is arranged on the surface of the second insulating layer part.

REFERENCES:
patent: 5338975 (1994-08-01), Cole, Jr. et al.
patent: 5410107 (1995-04-01), Schaper

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