Semiconductor device incorporating module structure

Details Semiconductor device incorporating module structure Semiconductor device incorporating module structure

2002-06-14

2003-07-22

Martin, David (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S741000, C361S756000, C361S807000, C439S377000, C439S946000, C174S13800J

Reexamination Certificate

active

06597582

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a high-density packaging technique for packaging a multi-function semiconductor device formed by mounting a module board on a block socket. More particularly, the present invention relates to a semiconductor device and a method of packaging a semiconductor device, which materialize greater packaging reliability, greater ease of packaging, facilitated reworking of a semiconductor device, a higher-performance system board, a more efficient dissipation characteristic, cost reduction stemming from a compact system being embodied through use of a three-dimensional package, a shorter length of electrical connection between semiconductor devices, and faster processing speed as compared with the case of a conventional semiconductor and packaging method.
2. Background Art
FIG. 14
is a perspective view showing a conventional semiconductor device which corresponds to background art of a first type, and
FIG. 15
is a structural cross-sectional view showing another conventional semiconductor device which corresponds to background art of a second type. In
FIG. 14
, reference numeral
2
designates a module board;
3
designates a semiconductor chip; and
20
designates a solder ball. In
FIG. 15
, reference numeral
2
designates a module board;
3
designates a semiconductor chip;
4
designates a bump;
5
designates an under-fill resin;
6
designates a system board; and
20
designates a solder ball.
A semiconductor device of ball grid array (BGA) type, a semiconductor device of pin grid array (PGA) type, or a semiconductor device of land grid array (LGA) type (each falling under background art of the first type as shown in
FIG. 14
) is described as a conventional semiconductor device which has a plurality of input/output terminals and is used for an application requiring high electrical and thermal performance. In a semiconductor device of these types, a single or a plurality of semiconductor chips
3
are mounted on the module board
2
serving as a high-density wiring board, and the solder balls
20
are provided on the underside of the module board
2
for establishing an electrical contact between electrodes of the semiconductor chips
3
and the outside of a semiconductor device module.
There is also described a semiconductor device of multi-chip module type (MCM) (which falls under background art of the second type as shown in FIG.
15
). Specifically, a single or a plurality of semiconductor chips
3
are mounted on the module board
2
serving as a high-density wiring board while being secured by the underfill resin
5
. The solder balls
20
are provided on the underside of the module board
2
for establishing an electrical contact between the bumps
4
formed on the underside of each of the semiconductor chips
3
and the outside of a semiconductor chip module, thereby constituting a multi-chip module. This multi-chip module is mounted on the system board
6
by way of the solder balls
20
, interconnection pins, or like elements.
However, the above-described background art involves the following problems. In a semiconductor device of MCM type having a large number of input/output terminals as a multi-pin-type semiconductor device, signals are exchanged within the module, thereby diminishing the number of input/output terminals to be used for connection with the system board
6
. However, the semiconductor device of the background art encounters a first problem; specifically, in association with an improvement in the performance of the system board
6
, the MCM is required to have a larger number of terminals. If the outer dimension of the MCM are increased, there may arise a reduction in packaging reliability and electrical performance of the semiconductor device, an increase in cost of the semiconductor device, and bloating of the system board
6
.
A second problem encountered by the semiconductor device of MCM type is that an increase in the outer dimension of the MCM induces a warpage of a board or an error in positional accuracy of terminals, thus rendering difficult packaging of the MCM on the system board
6
(i.e., a problem in relation to packaging characteristic).
A third problem of the semiconductor device of the background art is that an increase in the outer dimensions of the semiconductor device results in deterioration of the packaging reliability of the semiconductor device, due to a difference in coefficient of thermal expansion between the semiconductor chip
3
and the system board
6
(i.e., a problem in relation to packaging reliability). Particularly, the outer dimension of a semiconductor device of BGA type are limited to substantially a value of 40 to 50 mm or thereabouts. In an application which requires a semiconductor device having large outer dimensions; that is, a large number of terminals, a semiconductor device of PGA or LGA type is employed, and a socket must be interposed between the semiconductor device and a mounting board, thereby imposing a problem in relation to cost.
A fourth problem is that difficulty in replacing a semiconductor device or an MCM mounted on the system board
6
with another device for eliminating a failure or improving the performance of the system board
6
(i.e., a problem in relation to reworking). Particularly, a problem in relation to reworking becomes readily apparent particularly in the case of a semiconductor device of BGA type.
A fifth problem is that a semiconductor device is in principle mounted on the system board
6
two-dimensionally. As the performance of the semiconductor device improves, the system board
6
grows in size. Therefore, rendering the system board
6
compact is difficult (i.e., a problem in relation to miniaturization).
A sixth problem is that as the performance of the semiconductor device improves, the cost of the semiconductor device is remarkably increased for reasons of a resultant increase in the size of the system board
6
, a resultant decrease in the yield of the semiconductor device due to difficulty in packaging, a resultant requirement to use a socket for ensuring the packaging reliability of the semiconductor device, and a difficulty in reworking (i.e., a problem in relation to cost).
A seventh problem is that a connection of a radiating fin has been achieved by means of various contrivances. However, all of the contrivances are difficult, and demand exists for an improvement of the radiating film in terms of performance and cost (i.e., a problem in relation to heat dissipation).
An eighth problem is that the length of connection between semiconductor devices having many input/output terminals; particularly, a distance between semiconductor devices of MCM type, becomes longer, thereby hindering the semiconductor device from exhibiting sufficient high-speed performance (i.e., a problem in relation to high-speed characteristic).
SUMMARY OF THE INVENTION
The present invention has been conceived to solve these problems in relation to the background art and is aimed at providing a semiconductor device and a method of packaging a semiconductor device which, as compared with the case of a conventional semiconductor device and packaging method, materialize greater packaging reliability, greater ease of packaging, facilitation of reworking of the semiconductor device, a higher-performance system board, and a more efficient dissipation characteristic.
According to one aspect of the present invention, a semiconductor block module comprises a block socket and a module board fitted therein. The block socket is of an annular shape, and has connection terminals on upper and lower peripheral surfaces thereof, and has an inner groove formed on the inner surface thereof. The module board has a semiconductor chip mounted thereon, and fitted into the inner groove of the block socket. The module board is electrically connected to the block socket, and the connection terminals on the upper peripheral surface of the block socket may be mechanically fitted into and electrically connected to the connection term

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