Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Patent
1996-02-29
1997-10-28
Saadat, Mahshid D.
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
Passive components in ics
257467, 257666, H01L 2900, H01L 31058
Patent
active
056820577
ABSTRACT:
A semiconductor device is provided which comprises a semiconductor chip including at least one semiconductor element and at least two surface electrodes, at least two lead terminals one of which is electrically connected to a first one of the surface electrodes, a temperature fuse element provided adjacent to the semiconductor element, and a package commonly enclosing the semiconductor chip, the fuse element, and part of the lead terminals. The temperature fuse element includes a patterned conductor strip formed on an insulating surface to be melt-cut at a predetermined temperature. One end of the patterned conductor strip is electrically connected to a second one of the surface electrodes, whereas the other end of the patterned conductor strip is electrically connected to another of the lead terminals.
REFERENCES:
patent: 3558989 (1971-01-01), Dameme et al.
patent: 4157486 (1979-06-01), Fegley
patent: 4945398 (1990-07-01), Kurita et al.
patent: 5097247 (1992-03-01), Doerrwaechter
Bednarek Michael D.
Clark S. V.
Rohm & Co., Ltd.
Saadat Mahshid D.
LandOfFree
Semiconductor device incorporating a temperature fuse does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device incorporating a temperature fuse, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device incorporating a temperature fuse will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1028107