Semiconductor device including stacked chips having metal patter

Details Semiconductor device including stacked chips having metal patter Semiconductor device including stacked chips having metal patter

1997-08-18

1999-04-06

Chaudhuri, Olik

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

257686, H01L 2348

Patent

active

058922873

ABSTRACT:
A three-dimensional semiconductor circuit assembly wherein each of several circuit chips is provided with patterned metal layers that extend from the circuit surface onto an edge side of the chip, then the chips are adhesively bonded to opposite surfaces of one or more dielectric spacers, respectively, whereby the edge sides of the resulting multiple-chip stack are readily connected to metal patterns on a substrate.

REFERENCES:
patent: 5281852 (1994-01-01), Normington
patent: 5313096 (1994-05-01), Eide
patent: 5327327 (1994-07-01), Frew et al.
patent: 5347428 (1994-09-01), Carson et al.
patent: 5397916 (1995-03-01), Normington
patent: 5426072 (1995-06-01), Finnila
patent: 5426566 (1995-06-01), Beilstein, Jr. et al.
patent: 5432729 (1995-07-01), Carson et al.
patent: 5523619 (1996-06-01), McAllister et al.
patent: 5616962 (1997-04-01), Ishikawa et al.
patent: 5619067 (1997-04-01), Sua et al.
patent: 5677569 (1997-10-01), Choi et al.
patent: 5714802 (1998-02-01), Cloud et al.

Affiliated with

Also associated with

Rating

Semiconductor device including stacked chips having metal patter does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device including stacked chips having metal patter, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device including stacked chips having metal patter will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1374024