Semiconductor device including stacked chips having metal patter

Details Semiconductor device including stacked chips having metal patter Semiconductor device including stacked chips having metal patter

1999-01-18

2000-03-07

Monin, Jr., Donald L.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438107, 438118, 438119, H01L 2160

Patent

active

060339314

ABSTRACT:
A three-dimensional microchip circuit assembly process, wherein a three-layer dry adhesive film sandwich is used to prepare a stacked circuit cube.

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