Semiconductor device including semiconductor element mounted...

Details Semiconductor device including semiconductor element mounted... Semiconductor device including semiconductor element mounted...

2008-09-23

2008-09-23

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S787000, C257S685000, C257S686000, C257S723000, C257SE25006, C257SE25031, C257SE25015, C257SE25016, C257SE25020, C257SE25027

Reexamination Certificate

active

11077152

ABSTRACT:
A semiconductor device including a first semiconductor element mounted on a first surface of second semiconductor element, wherein solder balls are formed on the first surface of the second semiconductor element such that the first surface includes an area without solder balls. At least one first semiconductor element is mounted to the second semiconductor element at the area of the first surface without solder balls. The at least one first semiconductor element may be mounted to the second semiconductor element using solder joints.

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