Semiconductor device manufacturing: process – Semiconductor substrate dicing – With attachment to temporary support or carrier
Reexamination Certificate
2008-08-20
2010-06-01
Le, Dung A. (Department: 2818)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
With attachment to temporary support or carrier
C438S068000, C438S113000, C438S460000, C438S508000
Reexamination Certificate
active
07727862
ABSTRACT:
A semiconductor device includes a semiconductor constituent having a semiconductor substrate and a plurality of electrodes for external connection provided under the semiconductor substrate. An under-layer insulating film is provided under and around the semiconductor constituent. A plurality of under-layer wires are provided under the under-layer insulating film and electrically connected to the electrodes for external connection of the semiconductor constituent. An insulating layer is provided around the semiconductor constituent and on the under-layer insulating film. A frame-like insulating substrate is embedded in an upper surface of the insulating layer and positioned around the semiconductor constituent. A plurality of upper-layer wires are provided on the insulating substrate. A base plate on which the semiconductor constituent and the insulating layer are mounted is removed.
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International Search Report and Written Opinion of the International Searching Authority dated Mar. 9, 2009, issued in corresponding International Application No. PCT/JP2008/065348.
Casio Computer Co. Ltd.
Frishauf Holtz Goodman & Chick P.C.
Le Dung A.
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