Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1985-07-22
1986-12-30
Hearn, Brian E.
Metal working
Method of mechanical manufacture
Assembling or joining
29589, 29590, 29591, H01L 2348
Patent
active
046318054
ABSTRACT:
A semiconductor device including a metallurgically compatible unplated package is provided. The package includes a plateless copper alloy die mount area to which a semiconductor die is attached. The semiconductor die is metallized on its mounting surface to provide electrical contact. A metallic solder which is compatible with both the copper alloy and the die metallization joins the die to the die mount area. The package further includes a plateless copper alloy lead portion which is physically joined to the die mount area. The top surface of the semiconductor die is provided with a patterned metallization making electrical contact to selected portions of the die. Electrical contact is made between the top surface die metallization and the lead portion of the package by ultrasonically bonded copper ribbon. The die and interconnecting ribbon is then enclosed by an epoxy encapsulant or by a welded metal cover.
REFERENCES:
patent: 3316628 (1966-02-01), Lanj
patent: 4092664 (1978-05-01), Davis, Jr.
patent: 4170472 (1979-09-01), Olsen et al.
patent: 4238528 (1980-12-01), Myelo et al.
patent: 4321617 (1982-03-01), Duda et al.
patent: 4346396 (1982-08-01), Carroll, II et al.
patent: 4498121 (1985-02-01), Breedis et al.
patent: 4544442 (1985-10-01), Lassen
patent: 4546374 (1985-10-01), Olsen et al.
M. Fogiel et al., "Modern Microelectronics", vol. 1, pp. 627-629, Research and Education Association, 1981.
S. K. Ghandhi, "VLSI Fabrication Principles", pp. 453-470, John Wiley and Sons, Inc. 1983.
Olsen Dennis R.
Spanjer Keith G.
Fisher John A.
Hearn Brian E.
Motorola Inc.
Quach Tuan
Warren Raymond J.
LandOfFree
Semiconductor device including plateless package fabrication met does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device including plateless package fabrication met, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device including plateless package fabrication met will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1539056