Semiconductor device including plateless package fabrication met

Details Semiconductor device including plateless package fabrication met Semiconductor device including plateless package fabrication met

1985-07-22

1986-12-30

Hearn, Brian E.

Metal working

Method of mechanical manufacture

Assembling or joining

29589, 29590, 29591, H01L 2348

Patent

active

046318054

ABSTRACT:
A semiconductor device including a metallurgically compatible unplated package is provided. The package includes a plateless copper alloy die mount area to which a semiconductor die is attached. The semiconductor die is metallized on its mounting surface to provide electrical contact. A metallic solder which is compatible with both the copper alloy and the die metallization joins the die to the die mount area. The package further includes a plateless copper alloy lead portion which is physically joined to the die mount area. The top surface of the semiconductor die is provided with a patterned metallization making electrical contact to selected portions of the die. Electrical contact is made between the top surface die metallization and the lead portion of the package by ultrasonically bonded copper ribbon. The die and interconnecting ribbon is then enclosed by an epoxy encapsulant or by a welded metal cover.

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S. K. Ghandhi, "VLSI Fabrication Principles", pp. 453-470, John Wiley and Sons, Inc. 1983.

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