Semiconductor device including plateless package

Details Semiconductor device including plateless package Semiconductor device including plateless package

1984-05-18

1985-10-08

Edlow, Martin H.

357 67, 357 72, 357 81, H01L 2348, H01L 2302

Patent

active

045463743

ABSTRACT:
A semiconductor device including a metallurgically compatible unplated package is provided. The package includes a plateless copper alloy die mount area to which a semiconductor die is attached. The semiconductor die is metallized on its mounting surface to provide electrical contact. A metallic solder which is compatible with both the copper alloy and the die metallization joins the die to the die mount area. The package further includes a plateless copper alloy lead portion which is physically joined to the die mount area. The top surface of the semiconductor die is provided with a patterned metallization making electrical contact to selected portions of the die. Electrical contact is made between the top surface die metallization and the lead portion of the package by ultrasonically bonded copper ribbon. The die and interconnecting ribbon is then enclosed by an epoxy encapsulant or by a welded metal cover.

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Pressman et al, "Silver Metallurgy for Semiconductor Device", IBM Tech. Discl. Bull., vol. 13, No. 5, pp. 1118-1119, Oct. 1970.

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