Semiconductor device including means for dispersing and absorbin

Details Semiconductor device including means for dispersing and absorbin Semiconductor device including means for dispersing and absorbin

1994-06-03

1996-09-10

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257669, 257675, 257676, 257668, H01L 23495, H01L 23498

Patent

active

055548857

ABSTRACT:
A semiconductor device comprises an electrically insulating film having a device hole; a plurality of groups of leads, each group including of a large number of leads arranged in a predetermined pattern, in a plurality of lead formation regions on the surface of the film; an integrated circuit chip positioned within the device hole and with electrodes connected to inner lead portions of the leads; and a resin sealing portion that seals in at least the integrated circuit chip, the film, and the lead groups. The film comprises a first group of aperture portions including of aperture portions provided in regions outside the lead formation regions and a second group of aperture portions consisting of a plurality of aperture portions provided in the lead formation regions.

REFERENCES:
patent: 4809053 (1989-02-01), Kuraisji
patent: 5126824 (1992-06-01), Veda
patent: 5157478 (1992-10-01), Veda et al.
patent: 5196917 (1993-03-01), Veda et al.
patent: 5349238 (1994-09-01), Ohsawa et al.

Affiliated with

Also associated with

Rating

Semiconductor device including means for dispersing and absorbin does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device including means for dispersing and absorbin, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device including means for dispersing and absorbin will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1322919