Semiconductor device including means for alleviating stress caus

Details Semiconductor device including means for alleviating stress caus Semiconductor device including means for alleviating stress caus

1980-10-10

1981-12-08

James, Andrew J.

357 72, 357 74, 357 75, 357 81, H01L 2342, H01L 2344, H01L 2346

Patent

active

043050883

ABSTRACT:
A semiconductor device comprises a heat-radiating electrode plate, a semiconductor element soldered to the depressed portion formed in the heat-radiating electrode plate, a header lead soldered onto the semiconductor element, a terminal board of insulating material fixed on the heat-radiating electrode plate, and a lead terminal secured to the terminal board and with the one end thereof electrically and mechanically connected to the header lead. The semiconductor device further comprises means for mitigating the transmission to the solder of the stress generated along the length of the header lead by the difference in the coefficient of thermal expansion among the component parts, and means for alleviating the lateral stress generated in the solder by the difference in the coefficient of thermal expansion between the header lead and the semiconductor element. Thus, a semiconductor device is provided which is high in both resistance to thermal fatigue and vibrations, simple in construction and superior in operational efficiency.

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patent: 2779903 (1957-01-01), Geppert
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patent: 3258661 (1966-06-01), Mierendorf
patent: 3612957 (1971-10-01), Steigerwald
patent: 3925809 (1975-12-01), Striker
patent: 4057825 (1977-11-01), Narita et al.

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