Semiconductor device including gold interconnections where the g

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

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Details

257751, 257763, 257767, H01L 29417, H01L 2943

Patent

active

054752655

ABSTRACT:
In a semiconductor device having gold interconnections for connecting elements formed on a substrate with each other, the improvement is that the average dimension of gold grains constituting the gold interconnections is determined to be 0.17 through 0.25 times as large as width of the gold interconnections.

REFERENCES:
patent: 4674176 (1987-06-01), Tuckerman
patent: 5247204 (1993-09-01), Yokoyama

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