Semiconductor device including covering a semiconductor with...

Details Semiconductor device including covering a semiconductor with... Semiconductor device including covering a semiconductor with...

2011-01-04

2011-01-04

Brewster, William M. (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S111000, C438S112000

Reexamination Certificate

active

07863088

ABSTRACT:
A semiconductor device and method is disclosed. In one embodiment, the method includes placing a first semiconductor over an electrically conductive carrier. The first semiconductor is covered with a molding compound. A through hole is formed in the molding compound. A first material is deposited in the through hole.

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