Semiconductor device including an insulative layer having a gap

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating

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257698, 257774, 438118, H01L 2358

Patent

active

059172312

ABSTRACT:
A resin-encapsulated semiconductor device includes a semi-conductor substrate having a surface including an insulating film and an electroplated transmission line. To avoid a possible separation and/or peeling of the insulating film with respect to the substrate, a gap is present between the insulating film and the plated line.

REFERENCES:
patent: 4062040 (1977-12-01), Abbas et al.
patent: 5269880 (1993-12-01), Jolly et al.
patent: 5373190 (1994-12-01), Ichiyama
patent: 5521436 (1996-05-01), Temple

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