Semiconductor device including a substrate having clustered inte

Details Semiconductor device including a substrate having clustered inte Semiconductor device including a substrate having clustered inte

1998-01-05

1999-04-27

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257690, 257693, 257698, H01L 2352, H01L 2348, H01L 2304

Patent

active

058982175

ABSTRACT:
A semiconductor device (100) including a die (110) electrically connected to a substrate (120), wherein the substrate has a novel interconnect routing structure. The routing structure has a plurality of interconnects (122) including a plurality of intermediate vias (140), including both intermediate vias associated with supply interconnects and signal interconnects, that are clustered together to reduce undesirable mutual loop inductance (L.sub.m) and reduce switching noise (.DELTA.I). A plurality of first printed wires (128a) and a plurality of second printed wires (128b) may incorporated in the substrate for routing of the plurality intermediate vias in cluster form. The substrate may have a plurality of clusters of the intermediate vias.

REFERENCES:
patent: 5708296 (1998-01-01), Bhansali
patent: 5714801 (1998-02-01), Yano et al.
patent: 5763947 (1998-06-01), Bartley

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