Semiconductor device including a semiconductor package with elec

Details Semiconductor device including a semiconductor package with elec Semiconductor device including a semiconductor package with elec

1998-07-02

1999-11-02

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For high frequency device

257690, 257712, 257664, 257680, 257774, 257713, 257778, 257704, H01L 2312, H01L 2314, H01L 2348

Patent

active

059776315

ABSTRACT:
A semiconductor device includes a high-frequency semiconductor chip having first and second surfaces, and including a first high-frequency transmission line on the first surface and a first grounding conductor on the second surface; and a semiconductor package having third and fourth surfaces, and including a second grounding conductor on the third surface and a second high-frequency transmission line on the fourth surface. The high-frequency semiconductor chip is mounted on the semiconductor package so that the second surface opposes the third surface. The semiconductor device further includes first and second slots for electromagnetically coupling the first high-frequency transmission line to the second high-frequency transmission line. The first and second slots on the first and second grounding conductors, respectively, oppose each other and oppose the first and second high-frequency transmission lines.

REFERENCES:
patent: 4739389 (1988-04-01), Goedbloed
patent: 5422615 (1995-06-01), Shibagaki et al.
patent: 5438305 (1995-08-01), Hikita et al.
patent: 5796165 (1998-08-01), Yoshikawa et al.
patent: 5814883 (1998-09-01), Sawai et al.
patent: 5852391 (1998-12-01), Watanabe et al.

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