Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2007-07-10
2007-07-10
Williams, Alexander Oscar (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257SE23026, C257SE23044, C257SE23124, C257SE23135, C257SE23052, C257S708000, C257S107000, C257S689000, C257S730000, C257S732000, C257S731000, C257S688000, C257S690000, C257S692000, C361S760000, C361S749000, C361S777000, C361S776000
Reexamination Certificate
active
10946733
ABSTRACT:
A chip size package semiconductor device can have reliable solder mounting and improved mounting reliability. A semiconductor device of one embodiment can include a semiconductor chip (1) mounted to a bottom portion (11) of a metal base (10A). A metal base (10A) can have side portions (12) with connection electrodes (15A) having a surface level higher than that of electrodes (7and8) on a surface of the semiconductor chip (1) by a difference (d). The connection electrode (15A) can be formed on a projecting piece (16) that is bent outward away from remaining portions of the side portion (12). The semiconductor device can be mounted face down without abutting the semiconductor chip (1) against a mounting substrate, thereby preventing mechanical damage to a semiconductor chip (1). At the same time, a solder layer can be formed in the gap between electrodes (7and8) and the mounting substrate, thereby raising the reliability of the soldering connection.
REFERENCES:
patent: 3412788 (1968-11-01), Pomerantz
patent: 6853066 (2005-02-01), Hosoya
patent: 6992386 (2006-01-01), Hata et al.
patent: 2004/0021216 (2004-02-01), Hosoya
patent: 2004/0065462 (2004-04-01), Hayashi
patent: 2000-277542 (2000-10-01), None
patent: 2001-68503 (2001-03-01), None
patent: 2001-352009 (2001-12-01), None
patent: 2002-26067 (2002-01-01), None
Japanese Patent Office Action of Dec. 8, 2005.
English Translations of the indicated portions of the above-referenced Japanese Office Action.
U.S. Appl. No. 10/613,903, filed Feb. 5, 2004, Hosoya.
NEC Electronics Corporation
Walker Darryl G.
Williams Alexander Oscar
LandOfFree
Semiconductor device including a semiconductor chip mounted... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device including a semiconductor chip mounted..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device including a semiconductor chip mounted... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3749572