Semiconductor device including a plurality of semiconductor...

Details Semiconductor device including a plurality of semiconductor... Semiconductor device including a plurality of semiconductor...

2006-05-05

2010-06-29

Williams, Alexander O (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S777000, C257SE23179, C257SE25013, C257SE23146, C257S774000, C257S211000, C257S203000, C257S207000, C257S208000, C257S696000, C257S723000, C257S685000

Reexamination Certificate

active

07745919

ABSTRACT:
A semiconductor device comprising a plurality of semiconductor chips and a plurality of through-line groups is disclosed. Each of the through-line groups consists of a unique number of through-lines. The numbers associated with the through-line groups are mutually coprime to each other. When one of the through-lines is selected for the each through-line group, one of the semiconductor chip is designated by a combination of the selected through-lines of the plurality of the through-line groups.

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Japanese Office Action issued in Japanese Patent Application No. JP 2005-136659 dated May 19, 2009.
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