Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2008-01-22
2008-01-22
Pham, Hoai V (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S777000, C257SE27137
Reexamination Certificate
active
11129328
ABSTRACT:
A semiconductor device includes a first circuit element chip including a first surface on which a plurality of first electrodes are arranged, and a second circuit element chip including a first surface on which a plurality of second electrodes are arranged. The second circuit element chip is mounted on the first circuit element chip. The semiconductor device further includes an insulating film disposed on a side surface of the second circuit element chip and disposed between the first surfaces of the first and second circuit element chips. The semiconductor device still further includes a resin layer covering the second circuit element chip and the insulating film. Also, there is provided a manufacturing method of the semiconductor device which includes forming the insulating film after the second circuit element chip is mounted on the first circuit element chip.
REFERENCES:
patent: 6661939 (2003-12-01), Kaneko et al.
patent: 6992398 (2006-01-01), Farnworth
patent: 2001-257310 (2001-09-01), None
patent: 2002-299496 (2002-10-01), None
patent: 2004-056093 (2004-02-01), None
Oki Electric Industry Co. Ltd.
Pham Hoai V
Volentine & Whitt P.L.L.C.
LandOfFree
Semiconductor device including a plurality of circuit... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device including a plurality of circuit..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device including a plurality of circuit... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3926765