Semiconductor device including a photosensitive resin...

Details Semiconductor device including a photosensitive resin... Semiconductor device including a photosensitive resin...

2006-03-14

2006-03-14

Tran, Mai-Huong (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S664000, C257S724000, C257S728000, C257S482000, C257S662000, C522S018000

Reexamination Certificate

active

07012337

ABSTRACT:
A semiconductor device includes a substrate with a via hole. An electrode is formed on a surface of the substrate so that a portion of the electrode extends through the via hole. A photosensitive resin is formed over the surface so as to cover an aperture of the via hole.

REFERENCES:
patent: 4902726 (1990-02-01), Hayashi et al.
patent: 5528074 (1996-06-01), Goto et al.
patent: 2001-110897 (2001-04-01), None

Affiliated with

Also associated with

Rating

Semiconductor device including a photosensitive resin... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device including a photosensitive resin..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device including a photosensitive resin... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3546177