Semiconductor device including a first chip having an active ele

Details Semiconductor device including a first chip having an active ele Semiconductor device including a first chip having an active ele

1993-05-28

1995-08-29

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Passive components in ics

257531, 257777, H01L 2500

Patent

active

054463092

ABSTRACT:
A semiconductor device includes a first chip and a second chip. Active elements such as transistors are fabricated on the surface of the semiconductor substrate of the first chip. Passive elements such as inductors and capacitors are fabricated on the second chip. The first chip is so disposed on the second chip that the reverse surface of the first chip makes a contact onto the surface of the second chip. The active element and the passive element are electrically connected by bonding wire.

REFERENCES:
patent: 4697095 (1987-09-01), Fujii
patent: 4890077 (1989-12-01), Sun
patent: 5008736 (1991-04-01), Davies et al.
Minoru Takaya and Akihiko Fujisawa, "The Development of Composite Multilayer Hybrid Components", IEEE Tokyo Section, Denshi Tokyo No. 30, at pp. 62-66 (1991).

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