Semiconductor device including a coupling conductor having a...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond

Reexamination Certificate

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C257S666000, C257S667000, C257S668000, C257S669000, C257S670000, C257S671000, C257S672000, C257S673000, C257S674000, C257S675000, C257S676000, C257S677000, C257S734000, C257S739000, C257S748000, C257S750000, C257S762000, C257S765000, C257S775000, C257S781000, C257SE23079, C257SE23153, C438S123000, C438S614000

Reexamination Certificate

active

07839003

ABSTRACT:
While a semiconductor device is provided with a plurality of element electrodes5formed on a semiconductor element4and a plurality of lead terminal electrodes6formed on a lead frame, the semiconductor device is equipped with a coupling conductor which electrically connects at least one electrode among the above-described element electrodes5to at least one electrode among the above-described lead terminal electrodes6; the above-described coupling conductor is manufactured by a first conductor1and a second conductor2, the major components of which are metals; the first conductor1has been electrically connected to the second conductor2; and the element electrodes5and the lead terminal electrodes6have been electrically connected to the second conductor2respectively.

REFERENCES:
patent: RE35119 (1995-12-01), Blonder et al.
patent: 6849930 (2005-02-01), Nakajima et al.
patent: 2004/0135237 (2004-07-01), Funato et al.
patent: 2004/0217488 (2004-11-01), Luechinger
patent: 2007/0040250 (2007-02-01), Kajiwara et al.
patent: 2007/0187819 (2007-08-01), Nakajima
patent: 8-148623 (1996-06-01), None
patent: 2002-314018 (2002-10-01), None

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